Improvements in the encapsulation of electronic components emplo

Details Improvements in the encapsulation of electronic components emplo Improvements in the encapsulation of electronic components emplo

1989-10-13

1992-02-25

Lowe, James

Plastic and nonmetallic article shaping or treating: processes

Mechanical shaping or molding to form or reform shaped article

To produce composite, plural part or multilayered article

26427211, 26427217, 26432818, 26433121, B29C 4514

Patent

active

050911350

ABSTRACT:
An improved method for encapsulating an electronic component with a highly stable protective layer is provided. Such encapsulation is carried out by injection molding about the surface of the electronic component of an encapsulant composition comprising a molten melt-processable polyester which is capable of forming an anisotropic melt phase having uniformly blended therein about 0.1 to 30 percent by weight based upon the total weight of the composition of silicone oil and/or a silicone rubber. Quality encapsulation is made possible under conditions wherein damage to the electronic component is minimized, and the resulting product is well protected without damage under a wide variety of end use conditions including variations in temperature. The process is carried out in the substantial absence of deleterious mold shrinkage and the product exhibits an extremely low linear coefficient of thermal expansion which well protects the electronic component encased therein.

REFERENCES:
patent: 4632798 (1986-12-01), Eickman et al.
patent: 4719171 (1988-01-01), Ikenaga et al.

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