Improved solder interconnection between a semiconductor device a

Details Improved solder interconnection between a semiconductor device a Improved solder interconnection between a semiconductor device a

1979-06-29

1981-09-15

James, Andrew J.

357 68, 357 67, 357 65, H01L 2348, H01L 2946, H01L 2954

Patent

active

042900794

ABSTRACT:
A ball limiting metallurgy pad structure for a semiconductor device solder bond interconnection comprising:

REFERENCES:
patent: 3241931 (1966-03-01), Triggs et al.
patent: 3551997 (1971-01-01), Etter
patent: 3706015 (1972-12-01), Schimmer
patent: 3839727 (1974-10-01), Herdzik et al.
patent: 3881884 (1975-05-01), Cook et al.
patent: 4054484 (1977-10-01), Lesh
patent: 4113578 (1978-09-01), DelMonte

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