Improved process for producing uniformly plated microspheres

Details Improved process for producing uniformly plated microspheres Improved process for producing uniformly plated microspheres

1989-05-16

1990-07-24

Niebling, John F.

Chemistry: electrical and wave energy

Processes and products

204 30, 427222, 427306, 4274431, C25D 700, C23C 1818

Patent

active

049433555

ABSTRACT:
Cross-linked polymer microspheres are carefully separated into fractions of equal size and density by first using sieves and then using hydraulic separation in a cone. Each fraction is separately plated with copper. The copper plated microspheres are again separated into fractions of equal size and density. Each fraction is then given an additional metal plating. The thus plated microspheres have uniformly thick plating and have a maximized surface area for the amount of metal plated making them particularly useful as catalysts or in electrical products or processes. Microspheres having a plating of palladium exhibit a marked improvement in the adsorption of hydrogen both quantitatively and in rapidity.

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