Imprinting of partial fields at the edge of the wafer

Details Imprinting of partial fields at the edge of the wafer Imprinting of partial fields at the edge of the wafer

2011-05-03

2011-05-03

Crispino, Richard (Department: 1743)

Plastic and nonmetallic article shaping or treating: processes

Mechanical shaping or molding to form or reform shaped article

Deforming the surface only

C425S385000

Reexamination Certificate

active

07935292

ABSTRACT:
Edge field patterning of a substrate having full fields and partial fields may include patterning using a template having multiple mesas with each mesa corresponding to a field on the substrate. Polymerizable material may be deposited solely between the template and the full fields of the substrate. A non-reactive material may be deposited between the template and partial fields of the substrate.

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