Imprint method for manufacturing micro capacitive ultrasonic...

Etching a substrate: processes – Mechanically shaping – deforming – or abrading of substrate

Reexamination Certificate

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C029S594000, C029S595000

Reexamination Certificate

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07438823

ABSTRACT:
The present invention relates to an imprint method for manufacturing micro capacitive ultrasonic transducer, which uses a mold with a particularly patterned surface to imprint into a flexible material thus forming the oscillation cavities of the ultrasonic transducer. Such imprint method not only realizes the volume manufacturing and reduces the cost, but also can precisely control the geometrical size of the oscillation cavities and thus shorten the distance between the upper and the lower electrodes to the micro
ano level, largely improving the sensitivity of the transducer. Moreover, the present invention further changes the procedure for manufacturing micro capacitive ultrasonic transducer of the prior art, which can both save the process steps and overcome the disadvantages in the prior art.

REFERENCES:
patent: 6768246 (2004-07-01), Pelrine et al.
patent: 2005/0205422 (2005-09-01), Moser et al.

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