Implementing enhanced solder joint robustness for SMT pad...

Details Implementing enhanced solder joint robustness for SMT pad... Implementing enhanced solder joint robustness for SMT pad...

2009-03-24

2011-12-27

Chervinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S771000, C174S261000

Reexamination Certificate

active

08085550

ABSTRACT:
A method and a surface mount technology (SMT) pad structure are provided for implementing enhanced solder joint robustness. The SMT pad structure includes a base SMT pad. The base SMT pad receives a connector for soldering to the SMT pad structure. A standoff structure having a selected geometry is defined on the base SMT pad to increase thickness of the solder joint for the connector.

REFERENCES:
patent: 5468919 (1995-11-01), Shiozaki et al.
patent: 6160713 (2000-12-01), Floyd et al.
patent: 6402527 (2002-06-01), Ota
patent: 6566611 (2003-05-01), Kochanowski et al.
patent: 7393244 (2008-07-01), Brodsky et al.
patent: 7723855 (2010-05-01), Tsai et al.
patent: 2008/0266824 (2008-10-01), Wang
patent: 2009/0279272 (2009-11-01), Sun

Affiliated with

Also associated with

Rating

Implementing enhanced solder joint robustness for SMT pad... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Implementing enhanced solder joint robustness for SMT pad..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Implementing enhanced solder joint robustness for SMT pad... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4253909