Implementation of protection layer for bond pad protection

Details Implementation of protection layer for bond pad protection Implementation of protection layer for bond pad protection

2006-09-12

2006-09-12

Thai, Luan (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S014000, C438S113000, C438S015000, C438S110000, C257S048000, C257SE21521, C257SE21522, C257SE21523, C257SE21531, C257SE21524

Reexamination Certificate

active

07105379

ABSTRACT:
A method of protecting a bond pad during die-sawing comprising the following steps. A substrate having a bond pad formed thereover is provided. A bond pad protection layer is formed over the bond pad. The substrate is die-sawed and the bond pad protection layer is removed by heating.

REFERENCES:
patent: 4821148 (1989-04-01), Kobayashi et al.
patent: 4821944 (1989-04-01), Tsumura
patent: 6251694 (2001-06-01), Liu et al.
patent: 6358847 (2002-03-01), Li et al.
patent: 6579734 (2003-06-01), Aoki
patent: 6933614 (2005-08-01), Lee et al.

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