Implementation of an intermetallic capacitor

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

361303, 3613061, 361311, 3613215, 438239, H01G 400

Patent

active

061117420

ABSTRACT:
The present invention relates to a method of implementing an intermetallic capacitor in a multiple layer integrated circuit including, on a P-type substrate, at least five levels of metallization. The method includes letting remain, on either side of portions of end metallization levels of the capacitor, at least one portion of a biasable level distinct from the substrate and from the last metallization level, and biasing, at least above the capacitor and to the potential of the substrate, the two biasable portions.

REFERENCES:
patent: 5439840 (1995-08-01), Jones, Jr. et al.
patent: 5494841 (1996-02-01), Dennison et al.
patent: 5622882 (1997-04-01), Yee
patent: 5670808 (1997-09-01), Nishihori et al.
patent: 5684485 (1997-11-01), Paillardet et al.
patent: 5691209 (1997-11-01), Liberkowski
patent: 5696510 (1997-12-01), Paillardet et al.
patent: 5712813 (1998-01-01), Zhang
patent: 5777533 (1998-07-01), Kato et al.
patent: 5780910 (1998-07-01), Hashimoto et al.
patent: 5815103 (1998-09-01), Comminges et al.
patent: 5867066 (1999-02-01), Dell'Ova et al.
patent: 5926359 (1999-07-01), Greco et al.
patent: 5956262 (1999-09-01), Comminges et al.
French Search Report for French Patent Application No. 9711966, filed Sep. 22, 1997.
Patent Abstract of Japan, vol. 006, No. 147 (E-123), Aug. 6, 1982 and JP 57 071165, May 1, 1982.
Patent Abstract of Japan, vol. 095, No. 006, Jul. 31, 1995 and JP 058294, Mar. 3, 1995.
Patent Abstract of Japan, vol. 095, No. 008, Sep. 29, 1995 and JP 07 130953, May 19, 1995.
Patent Abstract of Japan, vol. 013, No. 364 and JP 01 120858, May 12, 1989.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Implementation of an intermetallic capacitor does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Implementation of an intermetallic capacitor, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Implementation of an intermetallic capacitor will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1255307

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.