Implantation of electrical feed-through conductors

Chemistry: electrical and wave energy – Processes and products

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

204 24, 204273, C25D 502, C25D 704

Patent

active

043681069

ABSTRACT:
Electrically conductive solid, dense feed-through paths for the high-speed low-loss transfer of electrical signals between integrated circuits of a single silicon-on-sapphire body, or between integrated circuits of several silicon-on-sapphire bodies, are provided by an electroforming method.

REFERENCES:
patent: 2682501 (1954-06-01), Teal
patent: 3259049 (1966-07-01), Uithoven
patent: 3301939 (1967-01-01), Krasnow
patent: 3483095 (1969-12-01), Bean
patent: 3654097 (1972-04-01), Degnan
patent: 3798136 (1974-03-01), Olsen

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Implantation of electrical feed-through conductors does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Implantation of electrical feed-through conductors, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Implantation of electrical feed-through conductors will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-777762

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.