Implantation method for uniform trench sidewall doping by scanni

Fishing – trapping – and vermin destroying

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437 16, 437 35, 437 80, 437 52, 437919, 357 236, H01L 21265

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050136739

ABSTRACT:
An ion implantation method comprising doping a trench sidewall formed in the surface of a semiconductor substrate, with impurities by intermittently rotating step ion implantation carried out in the state that said sidewall is angled with respect to an ion beam, wherein;

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Kaim, Robert E., "Improved VLSI Device Yields Through Control of Implant Angle", 2/90, Solid State Technology, p. 103.
"Beam Scanning System for Large Tilt Angle Ion Implantation" by M. Sasaki et al.; Nuclear Instruments and Methods in Physics Research B37/38 (1989), 469-471; North-Holland, Amsterdam.
"A New Isolation Method with Boron-Implanted Sidewalls for Controlling Narrow-Width Effect" by G. Fuse et al.; IEEE Transactions on Electron Devices, vol. ED-34, No. 2, Part 1, Feb. 1987.

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