Implantable medical device having an improved packaging system a

Details Implantable medical device having an improved packaging system a Implantable medical device having an improved packaging system a

1998-06-18

2000-02-15

Schaetzle, Kennedy J.

Surgery: light, thermal, and electrical application

Light, thermal, and electrical application

Electrical therapeutic systems

607 9, 29830, 361752, A61N 1375

Patent

active

060263253

ABSTRACT:
An implantable cardiac stimulation device having an improved multi-level electronic package is disclosed. The multi-lever package includes at least two stacked internal substrates for mounting electronic circuits, a protective lid for protecting the substrates, and an external interconnect structure mounted on the lid which is also capable of mounting electronic components. The interconnection between the at least two internal substrates is achieved by vertically-oriented wirebonds, and the interconnection between at least one internal substrate and the external interconnect structure is achieved by vertically-oriented brazed-on pins which pass through holes in the protective lid. This construction minimizes the planar dimensions of the electronic package and optimizes space in the physiologically-curved portions of the housing.

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