Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Reexamination Certificate
2006-06-20
2006-06-20
Estrada, Angel R. (Department: 2831)
Electricity: conductors and insulators
Boxes and housings
Hermetic sealed envelope type
C174S050610, C174S1520GM, C361S302000
Reexamination Certificate
active
07064270
ABSTRACT:
An implantable component including a feedthrough assembly and a method for forming the feedthrough assembly wherein a coating forming a fluid barrier over an insulator, an insulator-to-terminal pin interface and an insulator-to-ferrule interface is incorporated.
REFERENCES:
patent: 4233372 (1980-11-01), Bro et al.
patent: 4424551 (1984-01-01), Stevenson et al.
patent: 4678868 (1987-07-01), Kraska et al.
patent: 4841101 (1989-06-01), Pollock
patent: 5104755 (1992-04-01), Taylor et al.
patent: 5333095 (1994-07-01), Stevenson et al.
patent: 5406444 (1995-04-01), Selfried et al.
patent: 5564434 (1996-10-01), Halperin et al.
patent: 5821011 (1998-10-01), Taylor et al.
patent: 6275369 (2001-08-01), Stevenson et al.
patent: 6643903 (2003-11-01), Stevenson et al.
patent: 6903268 (2005-06-01), Marshall et al.
Cobian Kenneth E.
Marshall Mark T.
Ries Richard D.
Svensk James R.
Estrada Angel R.
Medtronic Inc.
Soldner Michael C.
Wolde-Michael Girma
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