Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1991-07-15
1992-12-01
Wojciechowicz, Edward J.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
257714, H01L 2302
Patent
active
051683482
ABSTRACT:
An impingement cooled compliant heat sink (CHS) is employed to extract heat from an array of computer chips in an electric module. A variety of embodiments and variations are provided. The most basic implementation is a metal sheet that is brought into contact with chips on a multi-chip module, and acts as a spreader plate for jet impingement immersion cooling with fluorocarbon, liquid nitrogen, or other dielectric liquids. This can increase cooling at a given flow rate by increasing the area for heat transfer. Slots and/or holes in teh sheet located between the chip sites serve to: (1) create flexible joints in the sheet between the chips to permit conformity to neighboring chip sites, (2) allow for clearance of decoupling capacitors and other structures on the substrate between the chips, and (3) permit the dielectric coolant to flow through the plate so that there will be no pressure difference across the CHS. The absence of pressure difference across the CHS is designed to render this cooling scheme relatively insensitive to pressure variations in the module.
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IBM Technical Disclosure Bulletin, vol. 32, No. 9A, Feb. 1990, pp. 106-107, "Multi-Orifice Fluorocarbon III Devices".
IBM Technical Disclosure Bulletin, vol. 21, No. 1, Jun. 1978, p. 185-"Thermally Enhanced III Structure".
Chu Richard C.
Ellsworth, Jr. Michael J.
Vader David T.
International Business Machines - Corporation
Ludwin Richard M.
Wojciechowicz Edward J.
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