Impingement cooling of components in an electronic system

Details Impingement cooling of components in an electronic system Impingement cooling of components in an electronic system

2005-10-25

2009-06-16

Duverne, Jean F (Department: 2839)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

Reexamination Certificate

active

07548421

ABSTRACT:
A cooling apparatus adapted for impingement cooling of electronic components in an electronic system comprises an air mover, one or more heat sinks configured with multiple fins, and one or more flexible tubing segments. The flexible tubing segments are coupled to the air mover and are configured to direct airflow onto the heat sinks for impingement cooling.

REFERENCES:
patent: 5183104 (1993-02-01), Novotny
patent: 5220804 (1993-06-01), Tilton et al.
patent: 5297005 (1994-03-01), Gourdine
patent: 5497825 (1996-03-01), Yu
patent: 5559673 (1996-09-01), Gagnon et al.
patent: 5818692 (1998-10-01), Denney, Jr. et al.
patent: 5917697 (1999-06-01), Wang
patent: 6019165 (2000-02-01), Batchelder
patent: 6113485 (2000-09-01), Marquis
patent: 6223813 (2001-05-01), Chrysler et al.
patent: 6280318 (2001-08-01), Criss-Puszkiewicz et al.
patent: 6408941 (2002-06-01), Zuo
patent: 6498725 (2002-12-01), Cole et al.
patent: 6529377 (2003-03-01), Nelson et al.
patent: 6650542 (2003-11-01), Chrysler et al.
patent: 6755242 (2004-06-01), White
patent: 6787691 (2004-09-01), Fleurial et al.
patent: 6790744 (2004-09-01), Chen et al.
patent: 6830097 (2004-12-01), Wattelet et al.
patent: 6876550 (2005-04-01), Sri-Jayantha et al.
patent: 7064957 (2006-06-01), Liang et al.
patent: 2004/0060690 (2004-04-01), Wattelet et al.
patent: 2004/0159422 (2004-08-01), Zuo et al.
patent: 2004/0250562 (2004-12-01), Adiga et al.
patent: 2005/0056404 (2005-03-01), Lee et al.
patent: 2005/0073812 (2005-04-01), Lin
patent: 2005/0081532 (2005-04-01), Scott
patent: 2005/0082040 (2005-04-01), Lee et al.
patent: 2005/0098299 (2005-05-01), Goodson et al.
patent: 2005/0178528 (2005-08-01), Ohashi et al.
patent: 2005/0180103 (2005-08-01), Ku
patent: 2005/0180105 (2005-08-01), Matsushima et al.
patent: 2002261220 (2002-09-01), None
Evelyn N. Wang et al., Micromachined Jets for Liquid Impingement Cooling of VLSI Chips, Journal of Microelectromechanical Systems, vol. 13, No. 5, Oct. 2004, pp. 833-842.
Luc Mongeau et al., Experimental Investigations of an Electro-Dynamically Driven Thermoacoustic Cooler, International Mechanical Engineering Congress and Exposition (IMECE) ASME 2001, pp. 1-12.
Evenlyn N. Wang et al., Micromachined Jet Arrays for Liquid Impingement Cooling of VLSI Chips, NNUN Abstracts 2002, Electronics, p. 28.
Evenlyn N. Wang et al., Micromachined Jet Arrays for Liquid Impingement Cooling of VLSI Chips.
Evelyn Wang, Microjet Impingement Cooling , Evelyn Wang Research Page, http://www.stanford.edu/˜enwang/research.htm., pp. 1-3.
Z.J. Zuo et al., Compact, Double Side Impingement, Air-To-Air Heat Exchanger, Thermacore, Inc., 780 Eden Road, Lancaster, PA 17601, USA.
S. Wu et al., Micro Heat Exchanger by Using Mems Impinging Jets, Electrical Engineering 136-93, California Institute of Technology, Pasadena, CA 91125.
Japanese Office Action dated May 1, 2008 (Translated into English).

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