Impingement cooled heat sink with low pressure drop

Heat exchange – With retainer for removable article – Electrical component

Reexamination Certificate

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Details

C165S104330

Reexamination Certificate

active

07597135

ABSTRACT:
Two embodiments of a heat exchanger assembly for cooling an electronic device are shown respectively in FIGS.1and3and each comprises a housing, a plurality of high fins, a plurality of low fins, a nozzle plate, an inlet, at least one outlet, a primary nozzle, and a plurality of secondary nozzles. In the first embodiment shown in FIG.1,the housing and the nozzle plate are circular in shape. In the second embodiment shown in FIG.3,the housing and the nozzle plate are rectangular in shape. Both embodiments include a plurality of secondary nozzles that are aligned outwardly of the primary nozzle and the center axis of the nozzle plate. The secondary nozzles direct the flow of the cooling liquid outwardly of the primary nozzle from the center thus creating an overall system pressure drop lower than that of other assemblies without a plurality of secondary nozzles.

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