Impermeable encapsulation system for integrated circuits

Details Impermeable encapsulation system for integrated circuits Impermeable encapsulation system for integrated circuits

1987-12-28

1989-04-25

Robinson, Ellis P.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428220, 428335, 4285395, 428689, 428901, 4284735, 428458, 428336, 428216, 428450, 174 522, 361400, 156628, 156644, 427 96, B32B 300, B32B 900, B23P 1500

Patent

active

048247162

ABSTRACT:
An impermeable encapsulation system for integrated circuit chips utilizes a polyimide-siloxane block copolymer as an undercoat applied to the chip surface and an impermeable outer coat comprised either of a non-reactive metal, such as titanium, tantalum or aluminum, or an amorphous semiconductor material comprising silicon-boron. All of these materials may be effectively applied at temperatures sufficiently low to avoid damaging the chip.

REFERENCES:
patent: 3772079 (1973-11-01), Louzon
patent: 4001870 (1977-01-01), Saiki et al.
patent: 4163072 (1979-07-01), Soos
patent: 4198444 (1980-04-01), Yerman

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