Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-04-03
2007-04-03
Dinh, Tuan (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S765000, C361S766000
Reexamination Certificate
active
10669386
ABSTRACT:
A thin film circuit module constructed for serial coupling to circuit conductors at printed and transmission line circuits. In one form of equalizer construction, thin film circuit elements are deposited on a supporting substrate and wherein a capacitor plate is defined a circuit resistor. Two connector applications serially couple the equalizer modules to trace conductors of a motherboard connector block and to cylindrical core conductors of a coaxial connector. Other hybrid equalizer constructions provide modules constructed of thin film resistors and pick-and-placed capacitors mounted piggyback to an equalizer module substrate.
REFERENCES:
patent: 4153885 (1979-05-01), Bacher
patent: 5947905 (1999-09-01), Hadjicostis et al.
patent: 6188297 (2001-02-01), Akiba
Broman Mark Hamilton
Brooks Mark
Howieson Mike
Huibregtse Brent
Okamoto Yasutsugu
Dinh Tuan
Thin Film Technology Corp.
Tschida D L
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