Impedance measuring apparatus of package substrate and...

Details Impedance measuring apparatus of package substrate and... Impedance measuring apparatus of package substrate and...

2007-11-06

2007-11-06

Nguyen, Vincent Q. (Department: 2858)

Electricity: measuring and testing

Impedance, admittance or other quantities representative of...

Lumped type parameters

Reexamination Certificate

active

11377195

ABSTRACT:
An impedance measuring apparatus includes a plurality of RF (radio frequency) probes; a plurality of rotation mechanisms coupled to the plurality of RF probes, respectively; a processing unit, and a mechanical controller. The mechanical controller controls the plurality of rotation mechanisms and the plurality of RF probes to measure package RF signals between terminals formed on a package substrate. The processing unit measures calibration RF signals between terminals formed on at least one calibration substrate; determines RF impedances of the package substrate from the package RF signals and phase differences corresponding to a thickness of the package substrate and distances between the terminals on the package substrate from the calibration RF signals, and calibrates the RF impedances based on the phase differences.

REFERENCES:
patent: 6518743 (2003-02-01), Kodato
patent: 2005/0258819 (2005-11-01), Hoshi et al.
patent: 11-148951 (1999-06-01), None
patent: 2001-153909 (2001-06-01), None
patent: 2003-43091 (2003-02-01), None

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