Impedance matched plug-in package for high speed microwave integ

Details Impedance matched plug-in package for high speed microwave integ Impedance matched plug-in package for high speed microwave integ

1986-07-24

1990-08-21

LaRoche, Eugene R.

Wave transmission lines and networks

Coupling networks

With impedance matching

333247, 174 525, 174 523, 357 74, H03H 738, H05K 506

Patent

active

049510118

ABSTRACT:
A TO can-style plug-in package employs a pin/glass interface. In a first embodiment the pin/glass seal interface has a center pin of reduced diameter embedded in a smaller outer diameter, lower dielectric constant glass than a conventional TO-can. The glass is surrounded by a metal ferrule. The metallic header through which the pin/glass interfaces extend is provided with a ridge adjacent to the end of a respective pin. This increase in thickness of the header surrounding each glass-embedded center pin provides a prescribed capacitive reactance component for compensating the inductive reactance of the interiorly extending segment of the center pin and any connecting lead through which the microwave integrated component is coupled to the pin. In a second embodiment, the thickness of insulator glass that surrounds the center conductor is less than the thickness of the header.

REFERENCES:
patent: 3117179 (1964-01-01), Brown
patent: 3515952 (1970-06-01), Robinson
patent: 3528102 (1970-09-01), Rodet et al.
patent: 3671793 (1972-06-01), Scarlett
patent: 3784726 (1974-01-01), Smith et al.
patent: 4644096 (1987-02-01), Gutierrez et al.

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