Impedance match connection using multiple layers of bond wires

Details Impedance match connection using multiple layers of bond wires Impedance match connection using multiple layers of bond wires

1985-03-04

1987-08-11

LaRoche, Eugene R.

Wave transmission lines and networks

Coupling networks

With impedance matching

333246, 333260, 361404, 174 685, 29829, 29850, H01P 500

Patent

active

046864920

ABSTRACT:
A bond wire connection between two semiconductor devices alleviates the problem of inductive loading at high frequencies by providing a capacitive effect which compensates for inductive reactance. The capacitive effect is provided by utilizing multiple parallel layers of bond wires at a common electrical connection point. As more layers are added the net impedance can be controlled so as to match the impedance driving the downstream semiconductor.

REFERENCES:
patent: 3688396 (1972-09-01), Kilby et al.
patent: 3852878 (1974-12-01), Munro
patent: 3862790 (1975-01-01), Davies et al.
patent: 4070084 (1978-01-01), Hutchison
patent: 4543544 (1985-09-01), Ziegner
patent: 4593243 (1986-06-01), Lao et al.

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