Impedance control with reduced stiffness contribution from...

Details Impedance control with reduced stiffness contribution from... Impedance control with reduced stiffness contribution from...

2005-07-12

2008-08-05

Chen, Tianjie (Department: 2627)

Dynamic magnetic information storage or retrieval

Head mounting

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Reexamination Certificate

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07408744

ABSTRACT:
Method and apparatus for reduced contribution to suspension hinge stiffness of an electrical interconnect metal layer while retaining substantial impedance reductions from the metal layer use a sinuous pattern of removed and retained subregions of the metal layer selectively and distributively to ease bending of the metal layer and decrease its stiffness contribution while the retained metal layer subregions provide a substantial proportion of the impedance reduction normally provided by the metal layer.

REFERENCES:
patent: 6028742 (2000-02-01), Kazama
patent: 6141187 (2000-10-01), Wong et al.
patent: 6249404 (2001-06-01), Doundakov et al.
patent: 6741426 (2004-05-01), Girard
patent: 6944936 (2005-09-01), Krinke
patent: 2006/0152854 (2006-07-01), Arya et al.
patent: 2006/0245112 (2006-11-01), Shum

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