Impact sound stressing holding assembly

Measuring and testing – Testing by impact or shock – Specimen impactor detail

Patent

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Details

73 7, G01N 332

Patent

active

041400020

ABSTRACT:
A holding assembly for impact sound stressing semiconductor wafers and the like including a novel fixture for securing the wafer across a sound tube by clamping between Teflon rings. A cover membrane is also secured across the sound tube to create a closed space defined by the sound tube, cover membrane and semiconductor wafer. Tungsten spheres located in the closed space bounce between the wafer and the membrane when vibrations are propagated in the sound tube for impact sound stressing the semiconductor wafer.

REFERENCES:
patent: 4004449 (1977-01-01), Gorey et al.

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