Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – At least one aryl ring which is part of a fused or bridged...
Reexamination Certificate
1999-03-22
2001-03-06
Buttner, David J. (Department: 1712)
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
At least one aryl ring which is part of a fused or bridged...
C525S09200D
Reexamination Certificate
active
06197873
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a resin composition useful for thin-wall molded products such as integrated circuit (IC) cards, playing cards, and floppy disks; structural components for office-automation appliances, communications equipment such as portable phones, and household electrical appliances; and automobile parts. More particularly, the present invention relates to an impact-resistant resin composition which comprises a polycarbonate resin and a polyester resin as main components thereof and which has improved impact resistance through the aid of an added specific epoxy-modified block copolymer, and to a molded product obtained by molding the resin composition.
2. Background of the Invention
It has recently been thought that electronic-commerce cards (electronic money) will be rapidly developed and put into full-scale practical use in the near future. Heretofore, polyvinyl-based materials have been used for manufacturing cards; however, it is assumed that substitution for polyvinyl resin will be strongly promoted due to the environmental problem of dioxin.
Plastic cards have a thickness as thin as 1 mm or less, and material used in production thereof requires high fluidity and impact resistance. ABS resin, polycarbonate resin, polybutylene terephthalate, and polyethylene terephthalate resins have been developed as a substitute for vinyl chloride; however, these resins have never combined high fluidity with high impact resistance. In an effort to improve the impact resistance, a method of adding elastomer to these resins has been tested; however, the elastomer suffers the problem of lacking affinity and dispersibility to the resins.
In view of the foregoing, the present inventors have disclosed in Japanese Patent Application Laid-Open (kokai) No. 25984/1995 an epoxy-modified block polymer or a partially-hydrogenated-epoxy-modified block polymer which is useful as an impact-resistance enhancer.
U.S. Pat. No. 2,676,525 discloses a composition which is obtained by dispersing a modified hydrogenated block copolymer (b) obtained by the following method in a thermoplastic resin (a) including polycarbonate resin, or polycarbonate resin and polyester resin. The modified hydrogenated block copolymer (b) is obtained by grafting a glycidyl-group-containing unsaturated compound to a hydrogenated block copolymer obtained by partially hydrogenating an aliphatic double bond based on a conjugated diene compound of a block copolymer including a conjugated diene and a vinyl-group-containing aromatic hydrocarbon. However, the glycidyl-group-modified hydrogenated block copolymer (b) which is used herein involves the problem of being likely to gel due to heat applied in the manufacturing process thereof and in the process of producing molded products therefrom.
Japanese Patent Application Laid-Open (kokai) No. 157504/1997 discloses a hydrogenated or nonhydrogenated block copolymer modified with an ethylenic-unsaturated-group-containing carboxylic acid (e.g. maleic anhydride) or derivatives thereof.
Japanese Patent Application Laid-Open (kokai) No. 48861/1996 discloses a hydrogenated block copolymer modified with an hydroxyl-group-containing &agr;,&bgr;-unsaturated carboxylic acid and an aromatic vinyl compound.
However, the disclosed polymers heretofore do not adequately meet the requirement of high impact resistance and mold-processability, especially for material used for thin-wall molded products such as IC cards.
SUMMARY OF THE INVENTION
An object of the present invention is to provide a resin composition for producing thin-wall molded products, which composition has excellent fluidity and dispersibility, and which especially combines excellent high impact resistance with mold-processability, and to provide a molded product obtained therefrom.
The present inventors have conducted earnest studies in order to solve the above problems and as a result have attained the present invention.
Accordingly, in a first aspect of the present invention, there is provided a resin composition comprising 100 parts by weight of a resin blend (I) formed of 40-80 wt. % of an aromatic polycarbonate resin (A) and 60-20 wt. % of an aromatic polyester resin (B), the sum of (A)+(B) being 100 wt. %; and 2-10 parts by weight of an epoxy-modified block polymer (G) and/or an epoxy-modified hydrogenated block polymer (H), wherein the epoxy-modified block polymer (G) is a polymer which is obtained by epoxidation of double bonds derived from the conjugated dien compounds in a block copolymer (E) which comprises in the molecule a polymer block (C) predominantly comprising an aromatic vinyl compound and a polymer block (D) predominantly comprising a conjugated diene compound; and the epoxy-modified hydrogenated block polymer (H) is a polymer which is obtained by epoxidation of residual double bonds in a partially hydrogenated block copolymer (F) which is formed by partial hydrogenation of double bonds derived from the conjugated diene compound in the above block copolymer (E).
Preferably, in the first aspect of the present invention, the aromatic polycarbonate resin (A) has a ratio of the number of terminal hydroxy groups to the total number of molecular ends in the polycarbonate resin of 1-40% (hereinafter the ratio may be referred to as a “terminal hydroxyl ratio”).
Preferably, in the first aspect of the present invention, the aromatic polyester resin (B) is at least one species selected from among polybutylene terephthalate (PBT), polyethylene terephthalate (PET), poly(1,4-cyclohexanedimethylene) terephthalate, and poly(1,4-cyclohexanedimethylene/ethylene) terephthalate.
Preferably, in the first aspect of the present invention, the resin composition further contains titanium oxide in an amount of 5-30 parts by weight based on 100 parts by weight of the resin blend (I).
Preferably, in the first aspect of the present invention or the resin composition further containing titanium oxide, the resin composition further contains a reaction accelerator for epoxy groups in an amount of 0.001-2 parts by weight based on 100 parts by weight of the resin blend (I).
In a second aspect of the present invention, there is provided a molded product formed by molding any of the resin compositions of the first aspect.
In a third aspect of the present invention, there is provided an IC card or playing cards formed by molding any of the resin compositions.
BEST MODES FOR CARRYING OUT THE INVENTION
The present invention will next be described in detail.
Aromatic Polycarbonate Resin (A)
In the present invention, homo-polycarbonates (obtained from one kind of bisphenol) and copolymerized-polycarbonates (obtained from a plurality of kinds of bisphenols) may be used as the aromatic polycarbonate resin (A), and the polycarbonates may be produced through any of the methods known in the art. In addition, the polycarbonates may be branched or linear, and a mixture of a linear polycarbonate and a branched polycarbonate may also be used.
In general, aromatic polycarbonate resins are produced in the presence of an acid-acceptor and a molecular-weight-controlling agent through reaction of a dihydric phenol and phosgene or through transesterification of a dihydric phenol with a compound such as a carbonate diester.
In the present invention, bisphenols are preferably used as the dihydric phenol, with 2,2-bis(4-hydroxyphenyl)propane—i.e., bisphenol A—being particularly preferred. Bisphenol A may be partially or entirely substituted with another divalent phenol. In addition to bisphenol A, examples of the dihydric phenols include bis(4-hydroxyphenyl)alkanes such as hydroquinone, 4,4′-dihydroxydiphenyl, bis(4-hydroxyphenyl)methane, or 1,1-bis(4-hydroxyphenyl)ethane; bis(4-hydroxyphenyl)cycloalkanes such as 1,1-bis(4-hydroxyphenyl)cyclohexane; compounds such as bis(4-hydroxyphenyl) sulfide, bis(4-hydroxyphenyl) sulfone, bis(4-hydroxyphenyl) sulfoxide, or bis(4-hydroxyphenyl) ether; alkylated bisphenols such as 2,2-bis(3-methyl-4-hydroxyphenyl)propane or 2,2-bis(3,5-dimethyl-4-hydroxyphenyl
Hamano Hiromitsu
Miyata Hirotaka
Buttner David J.
Daicel Chemical Industry, Ltd.
Nixon & Vanderhye P.C.
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