Immersion tin/lead alloy plating bath

Details Immersion tin/lead alloy plating bath Immersion tin/lead alloy plating bath

1992-06-15

1994-04-12

Niebling, John

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Displacement or replacement coating

427437, 4274431, 106 127, 106 122, B05D 118

Patent

active

053022564

ABSTRACT:
An immersion tin/lead alloy plating bath has a basic composition comprising an organic sulfonic acid, divalent tin and lead salts of the organic sulfonic acid and thiourea and further contains thiocyanic acid or derivative thereof, optionally with hydrated hydrazine. With this plating bath, an alloy deposit, which has a particularly desired Sn/Pb ratio of 60%/40% or so and is improved in terms of adhesion and homogeneity, can be stably obtained on the surface of copper or a copper alloy in a relatively low temperature region within a short span of time.

REFERENCES:
patent: 4844739 (1989-07-01), Josso et al.
Chemical Abstract 108:10173w Jan. 11, 1988.

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