Immersion testing porous semiconductor processing components

Details Immersion testing porous semiconductor processing components Immersion testing porous semiconductor processing components

1993-09-21

2000-07-11

McCall, Eric S.

Measuring and testing

Vibration

By mechanical waves

73629, 73644, G01N 2900

Patent

active

060855916

ABSTRACT:
To permit immersion ultrasonic testing of a semiconductor processing component manufactured of porous metal, a cover is sealed over the processing surface of the component. The cover creates an acoustically reflective air gap between the cover and the processing surface. Ultrasonic waves scanned across the component reflect from this gap, creating an image of the internal structure of the component.

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