Immersion exposure method and apparatus, and manufacturing...

Details Immersion exposure method and apparatus, and manufacturing... Immersion exposure method and apparatus, and manufacturing...

2005-12-23

2008-09-09

Rutledge, Della J. (Department: 2851)

Photocopying

Projection printing and copying cameras

Illumination systems or details

C355S071000, C355S072000, C378S034000

Reexamination Certificate

active

07423728

ABSTRACT:
There is disclosed an immersion exposure method of carrying out an exposure process in a state that liquid is at least partly filled between a substrate to be exposed and a projection optical system of an exposure apparatus carrying out the exposure process, comprising carrying out a process of making large a contact angle to the liquid with at least outer peripheral portion of a main surface of the substrate compared with a contact angle to the liquid with an area adjacent to the outer peripheral portion of the substrate, which area is a part of a surface of a substrate supporting side of a substrate support member supporting the substrate included in the exposure apparatus, and carrying out the exposure process.

REFERENCES:
patent: 2004/0207824 (2004-10-01), Lof et al.
patent: 2005/0175776 (2005-08-01), Streefkerk et al.
patent: 2005/0221234 (2005-10-01), Ito
patent: 2005/0237504 (2005-10-01), Nagasaka et al.
patent: 10-303114 (1998-11-01), None
patent: 2005-33204 (2005-02-01), None
patent: 2005-109146 (2005-04-01), None
patent: WO 2004/112108 (2004-12-01), None
Notification for Filing Opinion mailed by the Korean Patent Office on Nov. 23, 2006, in counterpart Korean Patent Application 10-2005-129525.
Onishi et al., “Method For Manufacturing Semiconductor Device”, U.S. Appl. No. 11/174,720, filed Jul. 6, 2005.

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