Immersion development and rinse machine and process

Details Immersion development and rinse machine and process Immersion development and rinse machine and process

1989-11-13

1991-06-18

Mathews, A. A.

Cleaning and liquid contact with solids

Apparatus

Sequential work treating receptacles or stations with means...

354322, 354324, 354330, 134 76, 134902, G03D 306, G03D 308

Patent

active

050252801

ABSTRACT:
A machine has been developed for photoresist processing which has two filtered upward flowing baths, one for the develop fluid and one for the rinse fluid. In order to be able to develop photoresist patterns with submicron geometries, it is necessary to retreat from the current method of developing on a conventional spin developer. The batch immersion develop would suffice in certain applications, but contamination and automation obstacles cannot be overcome with the batch immersion process. Also, the develop process cannot be accomplished on very small geometries which developing pattern side up due to ununiform developing across the wafer causing critical dimension sizing problems. The described concept utilized an upside down immersion process with automated in line capabilities. It requires a filtered bubble free, temperature controlled, slow upward flowing develop chemical which the wafer is immersed into while spinning very slowly. The process required critical timing capabilities and an expeditious transition from the develop to the rinse cycle which also requires a similar upside down immersion into the upward flowing filtered rinse fluid.

REFERENCES:
patent: 4136940 (1979-01-01), Liu
patent: 4429983 (1984-02-01), Cortellino et al.
patent: 4557785 (1985-12-01), Ohkuma
patent: 4857430 (1989-08-01), Millis et al.

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