Imide epoxy resins for sealing semiconductor elements

Details Imide epoxy resins for sealing semiconductor elements Imide epoxy resins for sealing semiconductor elements

1991-12-06

1993-02-23

Sellers, Robert E.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

523466, 525481, 525482, 525484, 528 96, 549551, 549553, C08G 5926, C08G 5932, C08G 7306, C08G 7310

Patent

active

051890828

ABSTRACT:
The present invention relates to novel epoxy resin compositions for sealing semiconductor elements, which comprise 0.1 to 20.0% by weight of imide-epoxy resins represented by the general formula (I) together with epoxy resins, curing agents, curing promoters and plasticizers, and which has improved heat resistant and moisture resistant properties: ##STR1## wherein, R.sub.1 and R.sub.2 represent H or --CH.sub.2).sub.n CH.sub.3 group, and

REFERENCES:
patent: 4555563 (1985-11-01), Hefner, Jr. et al.
patent: 4600769 (1986-07-01), Kumar et al.
patent: 4720521 (1988-01-01), Spielvogel et al.
patent: 4806430 (1989-02-01), Spielvogel et al.
patent: 4861810 (1989-08-01), Dewhirst
J. Macromol. Sci.-Chem., A 22(8), pp. 1101-1107 (1985), "Bisaspartimide-Diamines as Curing Agents for Epoxy Resins".
Kinjo et al., "Epoxy Molding Compounds . . . ", from Advances in Polymer Science 88, Springer-Verlag Berling Heid. 1989, pp. 1-48.

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