Imide epoxy resin composition for sealing semiconductor elements

Details Imide epoxy resin composition for sealing semiconductor elements Imide epoxy resin composition for sealing semiconductor elements

1992-10-21

1993-10-19

Krass, Frederick F.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

523429, 523443, 523466, 525476, 525482, 525484, 528 96, C08G 5926, C08G 5932, C08G 7306, C08G 7310

Patent

active

052546055

ABSTRACT:
An epoxy resin composition for sealing semiconductor elements comprising o-cresol-novolak type epoxy resins, curing agents, curing accelerators, plasticizer and a high performance epoxy resin selected from a group consisting of epoxy resins represented by the formulas (I-a), (I-b) and (I-c) is disclosed.
Use of the high performance epoxy resin in an amount of from 0.1 to 20.0% by weight improves the heat and moisture resistance of the epoxy resin composition. ##STR1## wherein, R.sub.1 and R.sub.2 represent independently H or (CH.sub.2) nCH.sub.3 radical, and

REFERENCES:
patent: 4600769 (1986-07-01), Kumar et al.
patent: 4636542 (1987-01-01), Hefner et al.
patent: 4786669 (1988-11-01), Dewhirst
patent: 5189082 (1983-02-01), Kim et al.

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