Imidazole compound-containing hardening agent composition, metho

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Processes of preparing a desired or intentional composition...

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

523443, 523466, 525486, 528117, C09J16302, C08L 6302, C08G 5968

Patent

active

052449394

ABSTRACT:
A hardening agent composition for epoxy resins and a method for forming the composition is disclosed, which comprises a low-reactive hardening agent, an imidazole compound and a zeolite, wherein the imidazole compound is substituted on the imidazole nucleus by at least one of (a) and (b): (a) an alkyl group having 2 or more carbon atoms and a polar group and (b) an alkenyl group. The hardening agent composition combined with an epoxy resin to form a thermosetting epoxy resin composition, capable of hardening under heat to give a hardened product, has a remarkably elevated adhesion strength.

REFERENCES:
patent: 3533987 (1970-10-01), Giambra et al.
patent: 3755253 (1973-08-01), Rice
patent: 3923571 (1975-12-01), Aoki et al.
patent: 3996175 (1976-12-01), Schreiber et al.
patent: 4335228 (1982-06-01), Beitchman et al.
patent: 4417010 (1983-11-01), Shimp
patent: 4499246 (1985-02-01), Tesson et al.
patent: 4826991 (1989-05-01), Sawa et al.
patent: 4891403 (1990-01-01), Farris

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Imidazole compound-containing hardening agent composition, metho does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Imidazole compound-containing hardening agent composition, metho, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Imidazole compound-containing hardening agent composition, metho will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2027011

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.