Imidazole compound and use thereof

Details Imidazole compound and use thereof Imidazole compound and use thereof

2004-03-18

2010-02-16

Ward, Jessica L. (Department: 1793)

Metal fusion bonding

Process

With protecting of work or filler or applying flux

C148S269000

Reexamination Certificate

active

07661577

ABSTRACT:
A water-based composition for treating copper or copper alloy surface for lead-free soldering, the composition comprising a compound represented by general formula (1):wherein R1is hydrogen or methyl, and either R2and R3represent chlorine and R4and R5represent hydrogen, or R2and R3represent hydrogen and R4and R5represent chlorine.

REFERENCES:
patent: 5498301 (1996-03-01), Hirao et al.
patent: 6264093 (2001-07-01), Pilukaitis et al.
patent: 0627499 (1994-12-01), None
patent: 2002-105662 (2002-04-01), None
European Search Report dated Nov. 17, 2006.
European Search Report dated Sep. 23, 2006.

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