Etching a substrate: processes – Forming or treating material useful in a capacitor
Patent
1997-10-31
1999-10-26
Powell, William
Etching a substrate: processes
Forming or treating material useful in a capacitor
216 13, 216 20, 216 33, 361763, B44C 122
Patent
active
059722312
ABSTRACT:
A method and apparatus for coupling high speed data components using imbedded PCB AC coupling capacitors is disclosed. The capacitor comprises a first and a second conductive plate of polygonal shape coupled to surrounding circuitry at the polygonal vertices of the polygonal plates. This configuration results in improved capacitor performance, particularly with respect to capacitive impedance and reflected waves for high bandwidth signals at the frequency ranges of interest.
REFERENCES:
patent: 5197170 (1993-03-01), Senda et al.
patent: 5486277 (1996-01-01), Barbee et al.
NCR Corporation
Powell William
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