Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2006-10-03
2006-10-03
Datskovskiy, Michael (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S704000, C361S719000, C257S710000, C257S712000, C029S841000
Reexamination Certificate
active
07116557
ABSTRACT:
Integrated circuit components are imbedded within a laminate substrate disposed on a thermally conductive core, which provides a thermal sink. The circuit components are electrically connected to the integrated circuit via flexible electrical interconnects such as flexible wire bonds. An electrically insulating coating, is deposited upon the flexible electrical interconnects and upon the exposed surfaces of the integrated circuit assembly. The coating provides rigidity, an electrically insulating barrier and a first environmental barrier for preventing contamination of the exposed surfaces of the integrated circuit assembly. A thermally conductive encapsulating material, such as silicon gel, encases the circuit components and the flexible electrical interconnects within a rigid or semi-rigid matrix. The encapsulating material provides additional mechanical support, a second environmental and a thermal sink for dissipation of heat.
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Gjesvold Jason B.
Hatcher Casey L.
McMeen Mark T.
Raby Jim D.
Bayless Howard H.
Datskovskiy Michael
STI Electronics, Inc.
Waddey and Patterson PC
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