Imaging module package

Details Imaging module package Imaging module package

2011-04-19

2011-04-19

Tran, Tan N (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Electromagnetic or particle radiation

C257S434000, C257S684000

Reexamination Certificate

active

07928526

ABSTRACT:
An exemplary imaging module package includes a substrate, an imaging sensor chip set on the substrate, a housing positioned on the substrate, and a lens module. The housing includes a first chamber enclosing the imaging sensor chip therein, a second chamber coaxially extending from the first chamber for receiving the lens module therein, and a shoulder between the first and second chambers. The shoulder abuts against a top surface of the imaging sensor chip.

REFERENCES:
patent: 6147389 (2000-11-01), Stern et al.
patent: 6734419 (2004-05-01), Glenn et al.
patent: 101001321 (2007-07-01), None

Affiliated with

Also associated with

Rating

Imaging module package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Imaging module package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Imaging module package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2737324