Imaging module and method of manufacturing imaging module

Details Imaging module and method of manufacturing imaging module Imaging module and method of manufacturing imaging module

2007-11-02

2010-10-05

Ometz, David L (Department: 2622)

Television

Camera, system and detail

Support or housing

C348S340000, C348S373000

Reexamination Certificate

active

07808551

ABSTRACT:
An imaging module includes a flexible printed circuit board which has a first area on which a first functional element is mounted, a second area on which a second functional element is mounted, and a third area which is formed between the first area and the second area, an electronic component which is mounted on the first area, and an imaging device which is mounted on the second area. The flexible printed circuit board is formed by an insulating layer which is integrated, spreading over the first area, the second area, and the third area. The flexible printed circuit board is formed such that the flexible printed circuit board can be bent at least in the third area.

REFERENCES:
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patent: 6613597 (2003-09-01), Stack
patent: 2001/0055073 (2001-12-01), Shinomiya
patent: 2004/0118595 (2004-06-01), Flammer et al.
patent: 2004/0223072 (2004-11-01), Maeda et al.
patent: 2005/0208702 (2005-09-01), Kim
patent: 10-192236 (1998-07-01), None

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