Imaging method to verify electrical conductivity across...

Details Imaging method to verify electrical conductivity across... Imaging method to verify electrical conductivity across...

2006-05-12

2009-08-04

Patel, Harshad (Department: 2855)

Thermal measuring and testing

Differential thermal analysis

C374S011000

Reexamination Certificate

active

07568832

ABSTRACT:
A rapid image-based method for validating good electrical contact between existing LSP material on a structure, and LSP material on an applied patch, thus ensuring continuous LSP through the patch. The method and apparatus are used in the repair of LSP by validating an electrical connection between new and existing LSP materials. It can also be used during manufacturing to ensure good contact between sections of LSP material.

REFERENCES:
patent: 4747310 (1988-05-01), Collins et al.
patent: 4760493 (1988-07-01), Pearson
patent: 5397530 (1995-03-01), Narasimhan et al.
patent: 5417494 (1995-05-01), Kempa et al.
patent: 6106463 (2000-08-01), Wilk
patent: 6492630 (2002-12-01), Nagahira
patent: 6636037 (2003-10-01), Ou-Yang
patent: 7287902 (2007-10-01), Safai et al.
patent: 7307431 (2007-12-01), Safai et al.
patent: 7312608 (2007-12-01), Georgeson et al.
patent: 7333898 (2008-02-01), Griess et al.
patent: 2006/0274812 (2006-12-01), Safai et al.
patent: 2007/0017297 (2007-01-01), Georgeson et al.
patent: 2007/0095160 (2007-05-01), Georgeson et al.
patent: 2007/0096751 (2007-05-01), Georgeson et al.
patent: 2007/0100582 (2007-05-01), Griess et al.
patent: 2007/0125189 (2007-06-01), Bossi et al.
patent: 2008/0000299 (2008-01-01), Georgeson
patent: 2008/0061774 (2008-03-01), Georgeson et al.

Affiliated with

Also associated with

Rating

Imaging method to verify electrical conductivity across... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Imaging method to verify electrical conductivity across..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Imaging method to verify electrical conductivity across... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4053740