Imaging light-sensitive material with etchable opaque polyamide

Radiation imagery chemistry: process – composition – or product th – Diazo reproduction – process – composition – or product – Composition or product which contains radiation sensitive...

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430155, 430166, 430167, 430145, 430271, 430294, 430323, G03C 180, G03C 152

Patent

active

043071724

ABSTRACT:
Disclosed is an imaging light-sensitive material which comprises a transparent substrate, [I] a polyamide layer containing an alcohol-soluble polyamide as the major component and having a thickness of from 2 to 11 microns and [II] a light-sensitive layer having a thickness of from 0.5 to 5 microns.

REFERENCES:
patent: 3549373 (1970-12-01), Homada et al.
patent: 3645732 (1972-02-01), Jones
patent: 3721557 (1973-03-01), Inoue
patent: 3778272 (1973-12-01), Hepher
patent: 4041204 (1977-08-01), Hepher et al.
patent: 4088492 (1978-05-01), Pope et al.
patent: 4207106 (1980-06-01), Odawara et al.
patent: 4232105 (1980-11-01), Shirohara et al.
patent: 4268601 (1981-05-01), Namiki et al.

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