Radiation imagery chemistry: process – composition – or product th – Radiation sensitive product – Identified backing or protective layer containing
Patent
1999-12-17
2000-12-19
Chea, Thorl
Radiation imagery chemistry: process, composition, or product th
Radiation sensitive product
Identified backing or protective layer containing
430531, 430533, 430617, 430619, 430631, G03C 1498, G03C 176
Patent
active
061625973
ABSTRACT:
A polyester support having an adjacent subbing layer which comprises a polymer or copolymer of glycidyl acrylate and/or glycidyl methacrylate improves the adhesion of a photothermographic imaging layer containing a poly(vinyl butyral) binder coated from an organic solvent. The subbing layer can be applied in the form of an aqueous dispersion in the prescence of a coalescing agent. Such a subbing layer does not adversely affect sensitometry in a photothermographic or thermographic element.
REFERENCES:
patent: 3501301 (1970-03-01), Nadeau et al.
patent: 3645740 (1972-02-01), Nishio et al.
patent: 4098952 (1978-07-01), Kelly et al.
patent: 4128426 (1978-12-01), Ohta et al.
patent: 4328283 (1982-05-01), Nakadate et al.
patent: 4609617 (1986-09-01), Yamazaki et al.
patent: 5618657 (1997-04-01), Rieger et al.
patent: 5677116 (1997-10-01), Zengerle et al.
patent: 5718981 (1998-02-01), Fleischer et al.
patent: 5968646 (1999-10-01), Grace et al.
Research Disclosure, Item No. 18358, Jul. 1979.
Japanese Patent Abstract 5134356 A.
Japanese Patent Abstract 59094756 A.
Bauer Charles L.
Fleischer Cathy A.
Chea Thorl
Eastman Kodak Company
Konkol Chris P.
LandOfFree
Imaging elements adhesion promoting subbing layer for phototherm does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Imaging elements adhesion promoting subbing layer for phototherm, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Imaging elements adhesion promoting subbing layer for phototherm will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-269986