Imaging element, imaging device, camera module and camera...

Details Imaging element, imaging device, camera module and camera... Imaging element, imaging device, camera module and camera...

2004-12-02

2008-08-19

Ye, Lin (Department: 2622)

Television

Camera, system and detail

Optics

C348S374000, C438S121000, C257S684000

Reexamination Certificate

active

07414663

ABSTRACT:
The method for manufacturing a camera module of the present invention includes forming a bump on each electrode portion of an imaging element. Next, a through hole is formed in a substrate. The imaging element is then mounted on a first side of the substrate having at least one bump such that a light receiving portion of the imaging element receives light via the through-hole of the substrate. A periphery of the imaging element is sealed to the substrate. Next, a lens unit is mounted on a second side of the substrate.

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European Search Report Sep. 3, 2002.
Japanese Office Action dated Mar. 18, 2008 for corresponding Japanese Application No. 11-249473.

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