Surgery – Endoscope – With particular arrangement of internal elements
Reexamination Certificate
1999-06-28
2001-11-20
Mulcahy, John (Department: 3739)
Surgery
Endoscope
With particular arrangement of internal elements
C600S109000, C348S076000
Reexamination Certificate
active
06319196
ABSTRACT:
BACKGROUND OF THE INVENTION
This application claims the priority of Japanese Patent Application No. 10-190226 filed on Jul. 6, 1998 which is incorporated herein by reference.
1. Field of the Invention
The present invention relates to an imaging element assembly unit for an endoscope, and more particularly, it relates to an assembly structure of an imaging element in which it is possible to make the diameter of the tip portion where the imaging element is arranged thinner.
2. Description of the Prior Art
In
FIG. 8
, one example (Japanese Patent Application Laid-Open Publication No. 5-15489) of the configuration of a conventional imaging element assembly body to try to make the diameter of the tip portion of an electronic endoscope thinner is shown. In
FIG. 8
, a package
2
to which a CCD
1
as a solid imaging element is connected and which also does the job of a circuit board has a side portion thereof cut off to be in an open state. To this package
2
, a CCD
1
is connected by a bonding wire
3
, and after that, a cover glass
4
is adhered onto the upper surface of the package by adhesives or the like, and further, similar adhesives or the like are also filled up in the side portion, and the interior of this package
2
is kept in an airtight state.
According to the configuration like this, the side portion of a conventionally used complete box-like package is cut off, and therefore the width of the imaging element assembly body can be made smaller, and it is possible to make the diameter of the tip portion thinner by arranging the longitudinal direction of this package
2
, for example, along an endoscope axis
100
. Furthermore, in the package
2
, the interior has an airtight structure, and therefore, the degradation of a color filter formed on the imaging surface of the CCD
1
can be restrained, and in the meantime, the protection of a micro lens arranged on this color filter or the like becomes possible.
However, in the configuration using the above package
2
, it is difficult to further make the diameter thinner, and if it is possible to further make the diameter thinner by suitably changing the structure of an imaging element or a circuit board at the imaging element assembly part like this, an assembly unit with a high use value can be obtained.
The present invention is made due to the above problems, and it is an object thereof to provide an imaging element assembly body for an endoscope in which it can easily be promoted to make the diameter of the tip portion of an endoscope thinner by changing the configuration of a circuit board in relation to an imaging element.
BRIEF SUMMARY OF THE INVENTION
In order to attain the object, an imaging element assembly unit for an endoscope according to the present invention, comprises an imaging element which images the interior of an observed object, and a circuit board including an electrode (terminal) to which an electrode of this imaging element is connected by a lead wire and formed so that the width in the electrode arranging direction thereof may be shorter than the width in the electrode arranging direction of the imaging element, wherein these are connected by the lead wire at a position where both ends of the circuit board retreat inside from both ends of the imaging element in each of the electrode arranging directions.
Furthermore, by sticking a cover glass on the imaging surface side of the imaging element while holding the lead wire in between, an airtight space can be formed on this imaging surface at given intervals.
According to the above configuration, a form where both sides in the electrode arranging direction of the circuit board retreat inside from both sides of the imaging element is made, and for example, when considering the case where both sides of these circuit board and imaging element are positioned near the inside peripheral surface of a round holding barrel which is an armor body, the inside diameter of the holding barrel can be made smaller by the size corresponding to the retreat of both sides of the narrowed circuit board to the inside, and it is possible to make the diameter thinner by this.
REFERENCES:
patent: 5754313 (1998-05-01), Pelchy et al.
patent: 6071760 (2000-06-01), Nakada
patent: 10216083 A (1998-08-01), None
patent: 05015489 A (1993-01-01), None
Fuji Photo Optical Co., Ltd.
Mulcahy John
Snider Ronald R.
Snider & Associates
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