Metal working – Method of mechanical manufacture – Assembling or joining
Patent
1984-08-01
1985-10-22
Hearn, Brian E.
Metal working
Method of mechanical manufacture
Assembling or joining
313367, 357 31, 148DIG24, 148DIG60, 148DIG172, H01L 3118, H01L 2714
Patent
active
045479577
ABSTRACT:
An imaging device includes a wafer of single crystal semiconductor material having a first surface with an input surfacing region which extends into the wafer from the first surface and a second surface with a charge storage portion which includes a plurality of discrete charge storing regions which extend into the wafer of the second surface. The wafer includes a potential barrier within the input signal sensing portion for controlling blooming. The wafer is improved by including a passivation region within the input sensing portion for stabilizing the energy level of the conductivity band of the minority carriers at the Fermi energy level of the semiconductor wafer. Additionally, an electrical leakage reduction region extends into the wafer from the second surface. The leakage reduction region is contiguous with each of the discrete charge storage regions.
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Savoye Eugene D.
Tomasetti Charles M.
Coughlin Jr. Vincent J.
Hearn Brian E.
Irlbeck Dennis H.
RCA Corporation
Schiavelli Alan E.
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