Imager system comprising an integrated optical filter...

Details Imager system comprising an integrated optical filter... Imager system comprising an integrated optical filter...

2007-07-17

2010-12-14

Lee, Eugene (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Field effect device

Charge transfer device

C257S225000, C257S440000, C257SE27134

Reexamination Certificate

active

07851826

ABSTRACT:
A method manufactures semiconductor chips each comprising a component implanted in the semiconductor. The method includes collectively implanting components onto a front face of a semiconductor wafer and fixing the a plate of a transparent material onto the front face of the wafer. Fixing the plate of transparent material is preceded by a step of depositing, on the front face of the wafer, at least one layer of polymer material forming an optical filter. Application is particularly to the manufacturing of imagers.

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patent: 0540215 (1992-10-01), None
patent: 07170366 (1995-07-01), None
patent: WO 02/16976 (2002-02-01), None

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