Imager package substrate

Radiant energy – Photocells; circuits and apparatus – Housings

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Details

250216, 257433, H01J 502

Patent

active

058215328

ABSTRACT:
An image head assembly comprising: a substrate with at least a pair of apertures formed in the substrate; an optical assembly having at least a pair of pins that mate with the apertures within the substrate, the pins to the optical assembly being fixedly secured to the apertures within the substrate; an image sensor located between the apertures covered by a cover glass above the image sensor on the optical assembly; interface means for providing an electrical connection between the substrate and the image sensor; a lens system mounted on top the cover glass; and a single element blur filter contained within the lens system. The assembly contains a single element blur filter such as a cross-pleated blur filter. The lens system is prevented from being a reverse telephoto lens system with use of a blur filter that does not require a large back focus and is instead a telephoto lens system.

REFERENCES:
patent: 4321747 (1982-03-01), Takemura et al.
patent: 4479298 (1984-10-01), Hug
patent: 4776088 (1988-10-01), Biggs et al.
patent: 4924297 (1990-05-01), Denda
patent: 5109269 (1992-04-01), Holzman
patent: 5298742 (1994-03-01), Friauf
patent: 5406454 (1995-04-01), Dinger et al.
patent: 5418691 (1995-05-01), Tokura
patent: 5468996 (1995-11-01), Chan et al.
patent: 5530291 (1996-06-01), Chan et al.
patent: 5532519 (1996-07-01), Bertin et al.

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