Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2011-04-12
2011-04-12
Smith, Zandra (Department: 2822)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C438S026000, C438S126000
Reexamination Certificate
active
07923298
ABSTRACT:
Methods for fabricating an imager die package and resulting die packages are disclosed. An imager die packaging process may include dicing through a fabrication substrate comprising a plurality of imager die. Thereafter, known good die (KGD) qualified from the imager die are repopulated, face down on a high temperature-compatible temporary carrier, the KGD on the temporary carrier are encapsulated and thereafter removed as a reconstructed wafer from the temporary carrier. Furthermore, a first plurality of discrete conductive elements on a back side of the reconstructed wafer may be partially exposed and, optionally, a second plurality of discrete conductive elements may be applied to the first plurality of discrete conductive elements. The encapsulated KGD are then singulated.
REFERENCES:
patent: 3976288 (1976-08-01), Cuomo, Jr.
patent: 4463073 (1984-07-01), Miyauchi et al.
patent: 4575330 (1986-03-01), Hull
patent: 4925515 (1990-05-01), Yoshimura et al.
patent: 4929402 (1990-05-01), Hull
patent: 4996010 (1991-02-01), Modrek
patent: 4999143 (1991-03-01), Hull et al.
patent: 5015424 (1991-05-01), Smalley
patent: 5058988 (1991-10-01), Spence
patent: 5059021 (1991-10-01), Spence et al.
patent: 5059359 (1991-10-01), Hull et al.
patent: 5076974 (1991-12-01), Modrek et al.
patent: 5087964 (1992-02-01), Hatta
patent: 5096530 (1992-03-01), Cohen
patent: 5104592 (1992-04-01), Hull et al.
patent: 5123734 (1992-06-01), Spence et al.
patent: 5130064 (1992-07-01), Smalley et al.
patent: 5133987 (1992-07-01), Spence et al.
patent: 5141680 (1992-08-01), Almquist et al.
patent: 5143663 (1992-09-01), Leyden et al.
patent: 5164128 (1992-11-01), Modrek
patent: 5173220 (1992-12-01), Reiff et al.
patent: 5174931 (1992-12-01), Almquist et al.
patent: 5174943 (1992-12-01), Hull
patent: 5182055 (1993-01-01), Allison et al.
patent: 5182056 (1993-01-01), Spence et al.
patent: 5182715 (1993-01-01), Vorgitch et al.
patent: 5184307 (1993-02-01), Hull et al.
patent: 5192469 (1993-03-01), Smalley et al.
patent: 5192559 (1993-03-01), Hull et al.
patent: 5209878 (1993-05-01), Smalley et al.
patent: 5234636 (1993-08-01), Hull et al.
patent: 5236637 (1993-08-01), Hull
patent: 5238639 (1993-08-01), Vinson et al.
patent: 5248456 (1993-09-01), Evans, Jr. et al.
patent: 5256340 (1993-10-01), Allison et al.
patent: 5258146 (1993-11-01), Almquist et al.
patent: 5264061 (1993-11-01), Juskey et al.
patent: 5267013 (1993-11-01), Spence
patent: 5273691 (1993-12-01), Hull et al.
patent: 5321622 (1994-06-01), Snead et al.
patent: 5344298 (1994-09-01), Hull
patent: 5345391 (1994-09-01), Hull et al.
patent: 5358673 (1994-10-01), Heller et al.
patent: 5378508 (1995-01-01), Castro et al.
patent: 5439622 (1995-08-01), Pennisi et al.
patent: 5447822 (1995-09-01), Hull et al.
patent: 5460703 (1995-10-01), Nulman et al.
patent: 5481470 (1996-01-01), Snead et al.
patent: 5495328 (1996-02-01), Spence et al.
patent: 5501824 (1996-03-01), Almquist et al.
patent: 5547906 (1996-08-01), Badehi
patent: 5554336 (1996-09-01), Hull
patent: 5555476 (1996-09-01), Suzuki et al.
patent: 5556590 (1996-09-01), Hull
patent: 5569349 (1996-10-01), Almquist et al.
patent: 5569431 (1996-10-01), Hull
patent: 5571471 (1996-11-01), Hull
patent: 5573722 (1996-11-01), Hull
patent: 5600181 (1997-02-01), Scott et al.
patent: 5609812 (1997-03-01), Childers et al.
patent: 5609813 (1997-03-01), Allison et al.
patent: 5610824 (1997-03-01), Vinson et al.
patent: 5622634 (1997-04-01), Noma et al.
patent: 5630981 (1997-05-01), Hull
patent: 5637169 (1997-06-01), Hull et al.
patent: 5651934 (1997-07-01), Almquist et al.
patent: 5659478 (1997-08-01), Pennisi et al.
patent: 5667820 (1997-09-01), Heller et al.
patent: 5672312 (1997-09-01), Almquist et al.
patent: 5675402 (1997-10-01), Cho et al.
patent: 5676904 (1997-10-01), Almquist et al.
patent: 5688464 (1997-11-01), Jacobs et al.
patent: 5693144 (1997-12-01), Jacobs et al.
patent: 5695707 (1997-12-01), Almquist et al.
patent: 5705016 (1998-01-01), Senoo et al.
patent: 5711911 (1998-01-01), Hull
patent: 5776409 (1998-07-01), Almquist et al.
patent: 5779967 (1998-07-01), Hull
patent: 5814265 (1998-09-01), Hull
patent: 5818005 (1998-10-01), Pratt et al.
patent: 5827394 (1998-10-01), Lu
patent: 5833869 (1998-11-01), Haas et al.
patent: 5854748 (1998-12-01), Snead et al.
patent: 5855718 (1999-01-01), Nguyen et al.
patent: 5855836 (1999-01-01), Leyden et al.
patent: 5869354 (1999-02-01), Leedy
patent: 5885511 (1999-03-01), Heller et al.
patent: 5897825 (1999-04-01), Fruth et al.
patent: 5902537 (1999-05-01), Almquist et al.
patent: 5902538 (1999-05-01), Kruger et al.
patent: 5904889 (1999-05-01), Serbin et al.
patent: 5933190 (1999-08-01), Dierickx et al.
patent: 5937265 (1999-08-01), Pratt et al.
patent: 5943235 (1999-08-01), Earl et al.
patent: 5945058 (1999-08-01), Manners et al.
patent: 5953590 (1999-09-01), Piper et al.
patent: 5969424 (1999-10-01), Matsuki et al.
patent: 5985523 (1999-11-01), Patton
patent: 5998867 (1999-12-01), Jensen et al.
patent: 6039830 (2000-03-01), Park et al.
patent: 6048948 (2000-04-01), Tochioka
patent: 6099783 (2000-08-01), Scranton et al.
patent: 6140151 (2000-10-01), Akram
patent: 6150240 (2000-11-01), Lee et al.
patent: 6245646 (2001-06-01), Roberts
patent: 6251488 (2001-06-01), Miller et al.
patent: 6259962 (2001-07-01), Gothait
patent: 6266874 (2001-07-01), DiStefano et al.
patent: 6268584 (2001-07-01), Keicher et al.
patent: 6283997 (2001-09-01), Garg et al.
patent: 6284072 (2001-09-01), Ryan et al.
patent: 6297138 (2001-10-01), Rimai et al.
patent: 6303469 (2001-10-01), Larson et al.
patent: 6307243 (2001-10-01), Rhodes
patent: 6322598 (2001-11-01), Meuris et al.
patent: 6323295 (2001-11-01), Muhlebach et al.
patent: 6323436 (2001-11-01), Hedrick et al.
patent: 6326698 (2001-12-01), Akram
patent: 6337122 (2002-01-01), Grigg et al.
patent: 6344402 (2002-02-01), Sekiya
patent: 6353257 (2002-03-01), Huang
patent: 6391251 (2002-05-01), Keicher et al.
patent: 6399464 (2002-06-01), Muntifering et al.
patent: 6403168 (2002-06-01), Meyer et al.
patent: 6407334 (2002-06-01), Jimarez et al.
patent: 6417022 (2002-07-01), Hsiao
patent: 6432752 (2002-08-01), Farnworth
patent: 6465329 (2002-10-01), Glenn
patent: 6468891 (2002-10-01), Williams
patent: 6471806 (2002-10-01), McKenna et al.
patent: 6472294 (2002-10-01), Meuris et al.
patent: 6482576 (2002-11-01), Farnworth et al.
patent: 6483719 (2002-11-01), Bachman
patent: 6498074 (2002-12-01), Siniaguine et al.
patent: 6500746 (2002-12-01), Williams
patent: 6509636 (2003-01-01), Tsai et al.
patent: 6514798 (2003-02-01), Farnworth
patent: 6518662 (2003-02-01), Smith et al.
patent: 6521844 (2003-02-01), Fuemiss et al.
patent: 6524346 (2003-02-01), Farnworth
patent: 6524881 (2003-02-01), Tandy et al.
patent: 6529027 (2003-03-01), Akram et al.
patent: 6537482 (2003-03-01), Farnworth
patent: 6544465 (2003-04-01), Farnworth et al.
patent: 6544821 (2003-04-01), Akram
patent: 6544902 (2003-04-01), Farnworth
patent: 6549821 (2003-04-01), Farnworth et al.
patent: 6551906 (2003-04-01), Oka
patent: 6562278 (2003-05-01), Farnworth et al.
patent: 6562661 (2003-05-01), Grigg
patent: 6569373 (2003-05-01), Napadensky
patent: 6569709 (2003-05-01), Derderian
patent: 6569753 (2003-05-01), Akram et al.
patent: 6582983 (2003-06-01), Runyon et al.
patent: 6585927 (2003-07-01), Grigg et al.
patent: 6593171 (2003-07-01), Farnworth
patent: 6607689 (2003-08-01), Farnworth
patent: 6611053 (2003-08-01), Akram
patent: 6632732 (2003-10-01), Williams
patent: 6644763 (2003-11-01), Gothait
patent: 6649991 (2003-11-01), Chen et al.
patent: 6658314 (2003-12-01), Gothait
patent: 6677238 (2004-01-01), Seki
patent: 6686225 (2004-02-01), Wachtler
patent: 6696363 (2004-02-01), Lee et al.
patent: 6696752 (2004-02-01), Su et al.
patent: 6713857 (2004-03-01), Tsai
patent: 6734032 (2004-05-01), Tandy et al.
patent: 6740962 (2004-05-01), Grigg
patent: 6746899 (2004-06-01), Grigg
patent: 6762502 (2004-07-01), Akram
patent: 6764933 (2004-07-01), Williams
patent: 6764935 (2004-07-01), Williams
patent: 6767815 (2004-07-01), Williams
patent: 6780744 (2004-08-01), Williams
patent: 6833627 (2004-12
Farnworth Warren M.
Oliver Steven
Micro)n Technology, Inc.
Perkins Pamela E
Smith Zandra
TraskBritt
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