Image TFT array of a direct X-ray image sensor and method of...

Semiconductor device manufacturing: process – Making passive device – Trench capacitor

Reexamination Certificate

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C257SE21372

Reexamination Certificate

active

07452782

ABSTRACT:
A method of fabricating an image TFT array of a direct X-ray image sensor includes forming a first transparent conductive layer on a substrate; forming a gate line including a gate electrode, a common line, and a common electrode jutting out from the common line; forming an insulation layer; forming a semiconducting island on the insulation layer in the transistor region; forming a first via hole for the common electrode; forming a data line and a source electrode and a drain electrode; forming a passivation layer and a second via hole penetrating the passivation layer for the source electrode; forming a second transparent conductive layer as a top electrode. The insulation layer is formed on the first transparent conductive layer to serve as a dielectric layer of a capacitor before the TFT structure formed and can be formed at a relatively high temperature.

REFERENCES:
patent: 2003/0038241 (2003-02-01), Choo et al.
patent: 2005/0263769 (2005-12-01), Chul Ahn

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