Image sensor with protective package structure for sensing area

Details Image sensor with protective package structure for sensing area Image sensor with protective package structure for sensing area

2006-11-28

2006-11-28

Luu, Thanh X. (Department: 2878)

Radiant energy

Photocells; circuits and apparatus

Housings

C257S434000

Reexamination Certificate

active

07141782

ABSTRACT:
An image sensor with a protective package structure for the sensing area is provided. The image sensor includes a transparent substrate and a semiconductor image-sensing chip. A conductive interconnection circuit is formed on at least the lower surface of the transparent substrate. The semiconductor image-sensing chip is electrically connected with the electric interconnection circuit of the substrate. A perimeter of the chip is underfilled with gum material. A dike is formed around the image-sensing area of the semiconductor image-sensing chip. The electric contact of the semiconductor image-sensing chip is positioned on outer side of the dike.

REFERENCES:
patent: 5352852 (1994-10-01), Chun
patent: 5969461 (1999-10-01), Anderson et al.
patent: 6368898 (2002-04-01), Nakada

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