Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2002-11-12
2004-09-14
Tran, Thanh Y. (Department: 2827)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S749000, C361S760000, C361S761000, C361S773000, C361S774000, C257S431000, C257S666000, C257S668000, C257S688000, C257S693000, C257S701000, C257S703000, C257S780000, C257S784000, C257S787000
Reexamination Certificate
active
06791842
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The invention relates to an image sensor structure.
2. Description of the Related Art
Referring to
FIG. 1
, a conventional image sensor includes a substrate
10
, a frame layer
18
, a photosensitive chip
26
, a plurality of wires
28
, and a transparent layer
34
. The substrate
10
has a first surface
12
formed with signal input terminals
15
, and a second surface
14
formed with signal output terminals
17
connected to BGA metallic balls
16
, which are then electrically connected to a printed circuit board (not shown). The frame layer
18
has an upper surface
20
and a lower surface
22
bonded to the first surface
12
of the substrate
10
to form a cavity
24
together with the substrate
10
. The photosensitive chip
26
is arranged within the cavity
24
formed by the substrate
10
and the frame layer
18
and is mounted on the first surface
12
of the substrate
10
. Each of the plurality of wires
28
has a first terminal
30
electrically connected to the photosensitive chip
26
, and a second terminal
32
electrically connected to a corresponding signal input terminal
15
of the substrate
10
. The transparent layer
34
is placed on the upper surface
20
of the frame layer
18
.
According to the above-mentioned structure, when the photosensitive chip
26
is made larger and plural wires
28
are to be bonded and electrically connected to the signal input terminals
15
of the substrate
10
, the gap between the photosensitive chip
26
and the frame layer
18
will be reduced. If the designed gap is too small, the package processes cannot be performed. Therefore, when the photosensitive chip
26
is made larger, the substrate
10
has to be enlarged, which may not meet the miniaturized requirement of the product.
In view of the above-mentioned problems, it is an important object of the invention to provide an image sensor having a reduced volume and thus may be more practical.
SUMMARY OF THE INVENTION
An object of the invention is to provide an image sensor capable of facilitating the manufacturing processes and increasing the yield.
Another object of the invention is to provide an image sensor, which has a standard package volume and a photosensitive chip packed therein. The size of the chip may be changed without increasing the package volume of the image sensor.
Still another object of the invention is to provide an image sensor capable of simplifying the manufacturing processes and reducing the manufacturing costs, and thus making the image sensor more practical.
To achieve the above-mentioned objects, the invention provides an image sensor including a substrate, a frame layer, signal input terminals, a photosensitive chip, a transparent layer, a plurality of wires and a glue layer. The substrate has a first surface and a second surface opposite to the first surface. The frame layer is placed on the first surface of the substrate to form a cavity together with the substrate. The signal input terminals are formed on the frame layer. The photosensitive chip has plural bonding pads, and is placed on the first surface of the substrate and positioned within the cavity. The transparent layer is placed over the frame layer to define, in the cavity, at least one exposure area through which the bonding pads of the photosensitive chip are exposed. The wires penetrate through the at least one exposure area and electrically connect the bonding pads of the photosensitive chip to the signal input terminals on the frame layer. The glue layer covers the at least one exposure area to seal the plurality of wires. Thus, the above-mentioned image sensor may be manufactured easily and may be more practical.
The invention also provides another image sensor including a substrate, a frame layer, a photosensitive chip, a transfer medium, and a transparent layer placed over the frame layer. The substrate has a first surface and a second surface opposite to the first surface. The frame layer is placed on the first surface of the substrate to form a cavity together with the substrate. The photosensitive chip has plural bonding pads, and is placed on the first surface of the substrate and positioned within the cavity. The transfer medium is electrically connected to the bonding pads of the photosensitive chip for transferring signals from the photosensitive chip.
REFERENCES:
patent: 4984059 (1991-01-01), Kubota et al.
patent: 5073008 (1991-12-01), Terashita et al.
patent: 5545913 (1996-08-01), Quinn et al.
patent: 5859423 (1999-01-01), Shimoyama et al.
patent: 6287890 (2001-09-01), Ho
patent: 6310421 (2001-10-01), Morishima
patent: 6577342 (2003-06-01), Wester
Kingpak Technology Inc.
Pro-Techtor Inter-national Services
Tran Thanh Y.
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