Image sensor package structure and image sensing module

Details Image sensor package structure and image sensing module Image sensor package structure and image sensing module

2007-11-20

2007-11-20

Lee, John R. (Department: 2878)

Radiant energy

Photocells; circuits and apparatus

Photocell controlled circuit

C250S239000, C359S811000

Reexamination Certificate

active

11464564

ABSTRACT:
An image sensor package structure and an image sensing module are proposed. A substrate, a frame and a light transparent layer are used to package an image sensing chip to form the image sensor package structure. The frame is mounted on the substrate and located around the image sensing chip. The top of the frame extends toward the image sensing chip and upwards to form a locking and placing portion with an L-shaped cross section. Bend positions of the locking and placing portion form a placement space formed to accommodate and position the light transparent layer. The structure is simple, the fabrication is easy, and the gluing and packaging operations can be facilitated. Moreover, when the image sensor package structure and a lens set are assembled into an image sensing module, a lens base with a smaller size can be used to shrink the package area.

REFERENCES:
patent: 6559439 (2003-05-01), Tsuchida et al.
patent: 6946316 (2005-09-01), Glenn et al.
patent: 7092174 (2006-08-01), Yamaguchi et al.
patent: 2006/0023107 (2006-02-01), Bolken et al.
patent: 2006/0192230 (2006-08-01), Wood et al.
patent: 2007/0064317 (2007-03-01), Chen et al.

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