Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With reflector – opaque mask – or optical element integral...
Reexamination Certificate
2006-03-16
2008-07-22
Lee, Calvin (Department: 2892)
Active solid-state devices (e.g., transistors, solid-state diode
Incoherent light emitter structure
With reflector, opaque mask, or optical element integral...
Reexamination Certificate
active
07402839
ABSTRACT:
An image sensor package structure includes a plastic substrate, frame layer, a chip, wires, a transparent layer, and an encapsulate layer. The plastic substrate has an upper surface, which is formed with first electrodes, and a lower surface, which is formed with second electrodes. The frame layer is arranged on the upper surface of the plastic substrate, a cavity is formed between the plastic substrate and the frame layer. The chip is mounted on the upper surface of the plastic substrate, and is located within the cavity. The plurality of wires are electrically connected the chip to the first electrodes of the plastic substrate. The transparent layer is mounted on the frame layer to cover the chip. And the encapsulate layer is encapsulated the frame layer, and is covered on the periphery the transparent layer.
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A. Marquez, Esq. Juan Carlos
Fisher Esq. Stanley P.
Kingpak Technology Inc.
Lee Calvin
Reed Smith LLP
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