Image sensor package and its manufacturing method

Details Image sensor package and its manufacturing method Image sensor package and its manufacturing method

2007-06-05

2007-06-05

Pert, Evan (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Electromagnetic or particle radiation

C257S432000, C257S098000, C257S294000, C257S434000, C257S435000, C257S436000, C257S437000, C438S106000, C438S065000, C438S048000

Reexamination Certificate

active

11115574

ABSTRACT:
Disclosed are an image sensor package and its manufacturing method. As an example, an infrared ray protection glass is positioned directly on an image sensing region of an image sensor die. An electrically conductive wire and so forth located outside the image sensing region are encapsulated. At this time, one surface of the infrared ray protection glass is exposed outwardly. A mount holder to which a barrel with lenses is coupled is adhered on a surface of the encapsulant outside the infrared ray protection glass. The mount holder has a similar width to that of the image sensor die. Accordingly, the overall width of the image sensor package can become reduced, and the electrically conductive wire is protected against oxidization because it is surrounded by the encapsulant.

REFERENCES:
patent: 3880528 (1975-04-01), Petersen et al.
patent: 4055761 (1977-10-01), Shimomura
patent: 4491865 (1985-01-01), Danna et al.
patent: 4896217 (1990-01-01), Miyazawa et al.
patent: 4999142 (1991-03-01), Fukushima et al.
patent: 5023442 (1991-06-01), Taniguchi et al.
patent: 5068713 (1991-11-01), Toda
patent: 5122861 (1992-06-01), Tamura et al.
patent: 5220198 (1993-06-01), Tsuji
patent: 5274456 (1993-12-01), Izumi et al.
patent: 5365101 (1994-11-01), Tonai
patent: 5383034 (1995-01-01), Imamura et al.
patent: 5400072 (1995-03-01), Izumi et al.
patent: 5412229 (1995-05-01), Kuhara et al.
patent: 5424531 (1995-06-01), O'Regan et al.
patent: 5434682 (1995-07-01), Imamura et al.
patent: 5436492 (1995-07-01), Yamanaka
patent: 5444520 (1995-08-01), Murano
patent: 5463229 (1995-10-01), Takase et al.
patent: 5489995 (1996-02-01), Iso et al.
patent: 5523608 (1996-06-01), Kitaoka et al.
patent: 5570204 (1996-10-01), Kumashiro
patent: 5581094 (1996-12-01), Hara et al.
patent: 5604362 (1997-02-01), Jedlicka et al.
patent: 5617131 (1997-04-01), Murano et al.
patent: 5655189 (1997-08-01), Murano
patent: 5672902 (1997-09-01), Hatanaka et al.
patent: 5783815 (1998-07-01), Ikeda
patent: 5804827 (1998-09-01), Akagawa et al.
patent: 5811799 (1998-09-01), Wu
patent: 5821532 (1998-10-01), Beaman et al.
patent: 5825560 (1998-10-01), Ogura et al.
patent: 5861654 (1999-01-01), Johnson
patent: 5902993 (1999-05-01), Okushiba et al.
patent: 5932875 (1999-08-01), Chung et al.
patent: 5998878 (1999-12-01), Johnson
patent: 6011294 (2000-01-01), Wetzel
patent: 6011661 (2000-01-01), Weng
patent: 6020582 (2000-02-01), Bawolek et al.
patent: 6037655 (2000-03-01), Philbrick et al.
patent: 6060722 (2000-05-01), Havens et al.
patent: 6072232 (2000-06-01), Li et al.
patent: 6122009 (2000-09-01), Ueda
patent: 6130448 (2000-10-01), Bauer et al.
patent: 6147389 (2000-11-01), Stern et al.
patent: 6153927 (2000-11-01), Raj et al.
patent: 6184514 (2001-02-01), Rezende et al.
patent: 6384397 (2002-05-01), Takiar et al.
patent: 6384472 (2002-05-01), Huang
patent: 6392703 (2002-05-01), Uchino et al.
patent: 6476417 (2002-11-01), Honda et al.
patent: 6483101 (2002-11-01), Webster
patent: 6498624 (2002-12-01), Ogura et al.
patent: 6509560 (2003-01-01), Glenn et al.
patent: 6518656 (2003-02-01), Nakayama et al.
patent: 6627864 (2003-09-01), Glenn et al.
patent: 6627872 (2003-09-01), FuKamura et al.
patent: 6762796 (2004-07-01), Nakajoh et al.
patent: 6767753 (2004-07-01), Huang
patent: 6798031 (2004-09-01), Honda et al.
patent: 6813099 (2004-11-01), Yamaguchi
patent: 6867438 (2005-03-01), Maruyama et al.
patent: 6870238 (2005-03-01), Exposito et al.
patent: 6939456 (2005-09-01), Shiau
patent: 7031083 (2006-04-01), Chen
patent: 2003/0137595 (2003-07-01), Takachi
patent: 2004/0065952 (2004-04-01), Prior
patent: 2004/0217454 (2004-11-01), Brechignac et al.
patent: 2004/0251509 (2004-12-01), Choi
patent: 2005/0073036 (2005-04-01), Appelt et al.
patent: 2005/0104991 (2005-05-01), Hoshino et al.
patent: 2005/0258350 (2005-11-01), Van Arendonk et al.
patent: 2005/0258518 (2005-11-01), Yang et al.
patent: 2006/0016973 (2006-01-01), Yang et al.
patent: 1022329 (1964-07-01), None
patent: 2 146 504 (1985-04-01), None
patent: 59-228755 (1984-12-01), None
patent: 62-224047 (1987-10-01), None
patent: 09-021938 (1997-01-01), None
patent: 09-232548 (1997-09-01), None
patent: 10-302587 (1998-11-01), None
patent: WO 93/22787 (1993-11-01), None
patent: WO 00/038103 (2000-06-01), None
patent: WO 03/019660 (2003-03-01), None

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